K‑Bond Universal – Light‑Cured Universal Bonding Agent
- Regular price
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$90.00 - Regular price
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- Sale price
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$90.00
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A light-cured universal dental adhesive designed for flexible bonding across total-etch, selective-etch, and self-etch protocols.
⭐ Three Etching Modes
Compatible with total-etch, selective-etch, and self-etch techniques for flexible restorative workflows.
Compatible with total-etch, selective-etch, and self-etch techniques for flexible restorative workflows.
⭐ No Separate Dual-Cure Activator
Designed to bond with dual-cure and self-cure restorative materials without a separate activator.
Designed to bond with dual-cure and self-cure restorative materials without a separate activator.
⭐ 10-MDP + Multiple Initiator System
Formulated with 10-MDP and a multiple-initiator system to support reliable bonding to enamel, dentin, and restorative substrates.
Formulated with 10-MDP and a multiple-initiator system to support reliable bonding to enamel, dentin, and restorative substrates.
⭐ Low Film Thickness
Approximately 6 μm film thickness in SPIDENT R&D internal testing, supporting a thin adhesive layer and marginal fit.
Approximately 6 μm film thickness in SPIDENT R&D internal testing, supporting a thin adhesive layer and marginal fit.
Why Clinicians Choose K-Bond Universal
- ✔ Total-etch, selective-etch, and self-etch compatibility
- ✔ Dual-cure and self-cure compatibility without a separate activator
- ✔ 10-MDP-based universal adhesive formulation
- ✔ Designed for direct bonding, repair, indirect luting, and hypersensitivity treatment
K-Bond Universal is a light-cured universal dental adhesive formulated with 10-MDP and a multiple-initiator system.
It is compatible with total-etch, selective-etch, and self-etch protocols, allowing clinicians to select an etching approach according to the restorative procedure.
With a mild pH of 3.5, K-Bond Universal is designed for compatibility with dual-cure and self-cure restorative materials without requiring a separate activator. Its hydrophilic characteristics before light curing support penetration into dentin, while the adhesive becomes hydrophobic after curing.
Indications listed by SPIDENT include direct bonding, repair cases, indirect luting, and hypersensitivity treatment. SPIDENT R&D internal testing also reports a low adhesive film thickness of approximately 6 μm.
K-Bond Universal is supplied in a 5 mL bottle.
With a mild pH of 3.5, K-Bond Universal is designed for compatibility with dual-cure and self-cure restorative materials without requiring a separate activator. Its hydrophilic characteristics before light curing support penetration into dentin, while the adhesive becomes hydrophobic after curing.
Indications listed by SPIDENT include direct bonding, repair cases, indirect luting, and hypersensitivity treatment. SPIDENT R&D internal testing also reports a low adhesive film thickness of approximately 6 μm.
K-Bond Universal is supplied in a 5 mL bottle.
Complete your restorative workflow with:
EsFlow® PLUS Injectable
EsFlow® LV
EsCom 250 Universal Composite
EsFlow® PLUS Injectable
EsFlow® LV
EsCom 250 Universal Composite
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Frequently Asked Questions
What is a universal dental adhesive used for?
K-Bond Universal is designed for restorative bonding workflows, including self-etch, selective-etch, and total-etch techniques depending on clinical preference.
Can K-Bond Universal be used with self-etch techniques?
Yes. K-Bond Universal is designed to support self-etch bonding workflows for restorative procedures.
Is K-Bond Universal compatible with total-etch workflows?
Yes. K-Bond Universal can be used in total-etch and selective-etch workflows based on the selected bonding protocol.
What are the advantages of a universal bonding agent?
Universal bonding agents can help simplify restorative workflows by supporting multiple etching techniques in one adhesive system.